JMAR - Products | Services - Microelectronics Services

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Microelectronics Services

Leveraging extensive specialized expertise in semiconductor design and processing, the Microelectronics Division provides process integration and maintenance support for the U.S. Government’s Defense Microelectronics Activity (DMEA) in Sacramento, California. The Division also designs and produces application specific integrated circuits (ASICs) for both military and commercial customers.

The following is a partial list of the company’s capabilities:

ENGINEERING AND ANALYTICAL SERVICES

Component Evaluation and Qualification

Time/Temperature Regression Infant Mortality

Sub-Assembly Design

Sonoscan CSAM (Test Method 1034)

X-Ray (Test Methods 2012 & 2030)

Die Shear Stud Pull (Test Method 2019 or 2027)

Bond Strength (Test Method 2011)

Resistance to solvents (Test Method 2015)

Steam Age/Solderability (Test Method 2003)

Salt Atmosphere (Test Method 1009)

Thermal Shock (Test Method 1011 - 65°C to 150°C)

Thermal Resistance (Test Method 1012)

Thermal Impedance

PIND (Test Method 2020)

High Mag Visual > 100X (Test Method 1010)

Lead Integrity (Test Methods 2004 & 2028)

ESD Testing (Test Method 3015)

Temperature Cycling (Test Method 1010 - 65°C to 150°C)

Hermetic Testing: Fine Leak/Gross Leak (Test Method 1014)

SEM Inspection (Test Method 2018)

Centrifuge: up to 40,000Gs (Test Method 2001)

Lid Torque (Test Method 2024)

Mechanical Shock and Vibration (Test Method 2002 & 2007 resp.)

HAST Screening 85/85

Internal Water Vapor: RGA (Test Method 1018)

Steady-State LIFE Test (Test Method 1005)

DOMESTIC ASSEMBLY

Multi-Chip and Monolithic Ceramic Product Assembly Services

Class 100 Clean Room

Silicon, SOS, GaAs

Die Attach

JM7000

Eutectic

Epoxy

Solder

Wire Bond

Aluminum

Gold

0.8mm to 1.25mm or larger

Seal

Solder

Glass Frit

Seam Seal

Can Weld

Vacuum Bake

Surface Mount Assembly

Radiation Tolerant Shielded Packages

DOMESTIC TEST AND MANUFACTURING

Test Temperature Standard Selections

Full Military Temperature Range : -55°C to +125°C

Industrial Temperature Range : -40°C to +85°C

Industrial Plus Temperature Range : -45°C to +105°C

Automotive Temperature Range : -40°C to +125°C

Commercial Temperature Range : 0°C to 70°C

Up-Screening of Commercial Grade Devices

Memory Testing: > 1 Million/month capacity, >200 MHz clock

Microprocessor/Microcontroller w/ OEM Vectors

Linear Testing

Logic Testing

ASIC Testing

RF Testing

Static and Dynamic Burn-in (125°C, 135°C, 145°C)

Controlled Chamber Testing with Insitu Thermo Couple Temp Control

Multi-site Handlers

Lead Trim/Form & Solder Finish

Part Marking & Cure

In addition to providing technical design, processing, and technical support, the Microelectronics Division also operates under the quality requirements of ANSI/ISO/ASQ 9000 2000. Subscribing to this standard, we provide high quality and high reliability semiconductor devices to our customers.

We utilize advanced 0.18 micron, 0.25 micron, and 0.35 micron CMOS technologies, as well as many other semiconductor processes such as BiCMOS and DMOS to develop digital, mixed signal, and analog devices. We also are able to integrate RAM, ROM, PLD, Flash Memory, Microprocessors, and other applications specific functional cores into our products.

In the area of technology services provided to the aerospace and government markets, the Microelectronics Division has very few competitors. The success of the Microelectronics Division in this area is due to the broad range of semiconductor process technologies it can address and its abilities to reach across many major suppliers for technology and support. The programs that the Microelectronics Division performs are high level engineering labor intensive activities, requiring in depth knowledge and complete understanding of the technology being installed. This type of work is generally not pursued by the major government contractors due to its high quality labor content and lack of direct production pay off from the use of such resources.

JMAR is moving to the forefront of semiconductor technology, and is able to offer a wide range of advanced cost effective choices for our customers’ product needs.