| General Description |
Automated vertically oriented proximity wafer stepper. Ideal for Synchrotron (SOR), Laser Plasma (LPP), and wide field optical sources. |
|
| Automation Features |
Masks – SMIF I/O
Wafers – Track, SMIF, FOUP, or Cassette
I/O (Use Choice)
Factory Data Interface |
|
| Exposure mode |
Proximity exposure |
|
| Gap / Gap Control |
10-50 ± 0.25 µm |
|
| Image field size |
30 mm x 30 mm typical
(Determined by mask and illumination field)
Field shuttering to 1 mm x 1 mm |
|
| Illumination source |
Compatible with SOR, LPP, or optical source (user supplied) |
|
| Mask size |
NIST standard (125 mm circular) |
|
| Wafer size |
75, 100, 125, and 150 mm sizes supported (user option) |
|
| Automatic Alignment Method |
JMAR ALX (through the mask, bright field) with AWIS (adaptive wavelength) feature |
|
| Alignment accuracy |
35 nm (tool-to-self) global
25 nm (tool-to-self) field by field |
|
| Throughput |
15 WPH (150 mm, 24 fields, global) |
|
| Dimensions (environmental chamber) |
2,800 mm X 2,800 mm X 2,600 mm (WxLxH) |